Fr4 Epoxy Copperplate

Model NO.: FR4 CCL Type: Fr4 Epoxy Copperplate Material: Fiberglass Maximum Voltage: >100KV Certification: UL, ISO9001, SGS Brand: Mj Solid Content: Epoxy Copperplate Formation Methods: Copper Clad Laminate Sheet Delivery: 7-10 Working Days MOQ: Fr4 Ccl Specification: ISO9001 HS Code: 85479090 Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate, Generator Chemistry: Hybrid Insulation Thermal Rating: H 180 Classification: Hybrid Insulation Materials Color: Yellow Density: Fr4 Epoxy Copperplate Samples: Copperplate Appliction: Motor & Generator Customizable: Ccl Trademark: MJ Origin: Xi′an, China 1. Description:  FR4 Copper Clad Laminate combines a woven glass fabric and an Epoxy Resin laminate (tg approximately 130°c) that contains bromine. The product provides consistent quality and good electrical properties under dry and humid conditions, as well as high flexural, impact, and bond strength at room temperatures. This product is suitable for a variety of structural, high humidity, and electrical insulation applications, which include terminal boards, lapping carriers.
 2.Specifications:
Thickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm .
Thickness of copper:18um, 35um, Other thickness is according to order. 
Face: 1 and 2 
Size: 1020mm*1220mm 
Features: 
1) The end face of foil covered board should be tidy without any delamination 
and crackle .
2) Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily. 
removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3) On laminated face, the defects such as bubble, impressed pitting, nick and 
glue lack and outer impurity which retard its use are not allowed .
3. Applications:  Usually used in PCB of computers, home electric appliances and other lines.
 
FR4 ccl technical date:

FR4 TECHNICAL DATA SHEET
NO	ITEM		UNIT	INDEX
1	Surface resistance after damp heat and recovery		MΩ	1.3x105
2	Volume resistivity after damp heat and recovery		MΩ.m	1.63x106
3	Permitivityafter damp heat and recovery		/	Max: 5.5
4	Dissipation factor after damp heat and recovery		/	0.017
5	Pulling strength		N	Min: 60
6	Peel strength after exposure to solvent vapour		N/mm	Min: 1.4
7	Blistering after 10s heat shock		/	No blistering or delamination
8	Solderability (wetting test)		S	2
9	Flexural strength		MPa	Min: 300
10	Flammability(vertical burning test)		/	FV0 or FV1
11	Water absorption		mg	Max:5.9
12	Measling		/	No measling or blistering or delamination
13	Warpage	Bow	mm	Max: 18
		Twist		Max: 20

 

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Product Categories : Epoxy Insulation Laminated Sheet